Infineon, ST, STATS ChipPAC join forces for wafer level packaging
unknown wrote an interesting post today on
Here’s a quick excerpt
Infineon has granted licenses for its eWLB chip packaging technology to competitor STMicroelectroncis as well as to Singapore-based packaging engineering company STATS ChipPAC. The move will give the licensees the opportunity to benefit from higher integration and lower cost — and Infineon will benefit from higher market acceptance at large customers.
Read the rest of this great post here